29 March 2023

Bordignon at DMC Expo 2023

From June 11th to June 14th, we will be at DMC Expo 2023 in Shanghai, booth number 4-J555 in Hall 4.1.

Die & Mold China arrives at its 22nd edition and it will bring together manufacturers of mold and die technologies for the manufacturing, automotive and electronic communications industries from around the world.

For more information, follow this link: www.dmcexpo.com/en/index.asp